Study on Adhesion Properties and Process Parameters of Electroless Deposited Ni-P Alloy for PEEK and Its Modified Materials

Polyetheretherketone (PEEK) and its fiber-reinforced materials are thermoplastic polymer with broad application prospects. Depositing Ni-P alloy on them can improve their poor conductivity electromagnetic shielding performance, further expand field. The effect of the plated parts is significantly impacted by bonding strength between PEEK coating. non-metallic substrate coating largely influenced surface characteristics substrate. Therefore, it significant to study how roughness modified fibers in affect adhesion In this study, was electroless deposited PEEK, 30% carbon-fiber-reinforced (CF30/PEEK), glass-fiber-reinforced (GF30/PEEK) varying roughness. influence studied. Additionally, concentrations nickel sulfate, sodium hypophosphite, pH, temperature deposition rate investigated for three materials. Based highest rate, process parameters were then optimized. results demonstrated that as increased, first increased decreased. Ra 0.4 ?m produced adhesion. adhered coatings more effectively than did. mechanism difference different PEEK-modified revealed. optimal were: sulfate: 25 g/L, hypophosphite: 30 pH: 5.0, temperature: 70 °C.